Pre-packaged Power Devices for PCB Embedded Power Electronics – P3EP

OVERVIEW

P3EP explored the development of embedded GaN pre-packages to enable compact, ultra-efficient power electronics. By embedding bare dies into miniaturised PCB-based packages, the project aimed to minimise parasitics, improve reliability, and support high-speed switching. 

TTPi’s role began with the design of evaluation subsystems for these pre-packages but grew to include the full design of the second and third pre-packages (PP2 and PP3). Working alongside consortium partners, we delivered hybrid GaN packaging solutions that supported both surface mounting and further embedding, opening multiple exploitation routes for industry adoption.  

P3EP

CLIENTS/PARTNERS

  • TTPi (The Thinking Pod innovations)
  • Camutronics
  • Cambridge GaN Devices (CGD)
  • PPM Power
  • RAM Innovations
  • CSA Catapult

OUR APPROACH

TTPi contributed across three development generations: 

PP1 / SS1: Single GaN die with quasi-gate driver. We created an evaluation board to assess switching and thermal performance.  

PP3 / SS3: Hybrid dual-die half-bridge package, both embeddable and surface-mountable. This pragmatic design reduced complexity, improved reliability, and enabled validation through a subsystem carrier board. 

PP2 / SS2: Dual-die half-bridge pre-package. We simplified subsystem design to validate basic switching. 

CAPABILITIES APPLIED

Embedded power modules, AC DC, DC AC, AC AC, Ultra efficient power conversion 

OUTCOME & IMPACT

P3EP delivered important advances: 

  • GaN pre-packages (650 V / 60 A) with no wire bonds, improved reliability, and ultra-high efficiency (>99%). 
  • Compact, 3D power blocks with reduced parasitics, enabling power densities up to 80% smaller than silicon-based equivalents. 
  • Hybrid packages supporting both surface mounting (SMD) and embedding options.   

Pre-Package Features

Single Switch Pre-Package:

  • Suitable for embedding into power electronics PCBs 
  • Compatible with GaN ICs
  • Non-isolated copper thermal pad

Half-bridge Pre-Package:

  • Variant 1: For further embedding into power electronics PCBs.
  • Variant 2: Dual-purpose surface mountable and embeddable
  • Compatible with GaN ICs
  • Isolated ceramic thermal pad
  • Half-bridge with minimised stray inductance and capacitance.

APPLICATIONS BEYOND THIS PROJECT

  • Motor control systems
  • LLC and PSFB converters
  • Multi-level converters
  • High density automotive and aerospace power modules
  • Data centres and telecom infrastructure