Low cost embedded heterogeneous component manufacturing process for integrated power electronics – ECOMAP

OVERVIEW

This project aimed to develop a low cost, scalable manufacturing process that integrates heterogeneous components such as semiconductor devices, passive elements, and magnetic materials directly into printed circuit board (PCB) structures. 

Through multiple collaborations, the initiative aimed to reduce size, cost, and complexity in power electronics systems while improving the performance. The programme spanned multiple work packages, combining experimental development, simulation, evaluation, and commercial engagement activities to deliver a validated integrated power electronics platform. 

CLIENTS/PARTNERS

  • The Thinking Pod Innovations (TTPi)
  • RAM Innovations Limited
  • University of Nottingham

OUR APPROACH

The project followed a phased R&D approach, progressing through iterative design, fabrication, and testing cycles: 

  • Development and validation of integrated manufacturing processes, embedding techniques and process design rules.
  • Multi-physics simulation and optimisation of 3D embedded structures for electrical, thermal, and mechanical performance. 
  • Electrical, thermal, and reliability testing of four generations of demonstrator switching cells, feeding results back into the design process. 
  • Continuous commercialisation and engagement with potential end-users to align technology outputs with market needs. 

CAPABILITIES APPLIED

Embedded power modules, Exploitation of ultra-high speed switching devices & conventional devices, Ultra efficient power conversion, EMI containment,  AC DC, DC AC, AC AC 

OUTCOME & IMPACT

The project delivered four functional generations of embedded power switching demonstrators, progressively integrating active and passive components: 

  • Generation 1: Basic embedded switch for validating embedding methods. 
  • Generation 2: Half-bridge switch pair with integrated driver and surface-mounted passives. 
  • Generation 3: Fully embedded switching cell with integrated input/output passives. 
  • Generation 4: Advanced switching cell incorporating full EMI return path and integrated shielding. 

APPLICATIONS BEYOND THIS PROJECT

  • Electric vehicle inverter and converters.
  • Renewable energy systems.